Triple Glory Products
Products
| Categories | Title | Description |
|---|---|---|
| Etch | TEL Etch SCCM |
1. Oxide Etcher. 2. Vintage：2006 3. Wafer size：12 inch. |
| Etch | TEL Etch Telius 3055SS |
1. Oxide Etcher. 2. Vintage：2001 3. Wafer size：12 inch. |
| Furnace / Oxide / LPCVD | TEL Indy Plus |
1. Poly Furnace. (Zro HiK process) 2. Vintage：2009 3. Wafer size：12 inch |
| Furnace / Oxide / LPCVD | TEL Indy |
1. DPoly Furnace. 2. Vintage：2007 3. Wafer size：12 inch |
| Furnace / Oxide / LPCVD | TEL Formula |
1. DPOLY Furnace. 2. Vintage：2009 3. Wafer size：12 inch |
| Furnace / Oxide / LPCVD | TEL Formula |
1. NIT Furnace. 2. Vintage：2007 3. Wafer size：12 inch |
| Furnace / Oxide / LPCVD | TEL Alpha303i |
1. TEOS Furnace. 2. Vintage：2005 3. Wafer size：12 inch |
| Furnace / Oxide / LPCVD | TEL Alpha303i |
1. FTP Anneal Furnace. 2. Vintage：2005. 3. Wafer size：12 inch |
| Furnace / Oxide / LPCVD | TELAlpha 8 |
1. AP Pyro Oxide 2. Heater Type : VMU Series 3. Max. Production wafer : 100 Pcs |
| Furnace / Oxide / LPCVD | TEL Alpha8 |
1. AP Sinter Anneal 2. Heater Type : VMM Series 3. Max. Production wafer : 100 Pcs |
| Etch | TEL TE8500P |
1. Oxide Etcher. 2. Vintage：1996. 3. Wafer size：8 inch. |
| Photos | DNS SK-200W-AVP |
1. Coat and Develop, 2C2D. 2. Vintage：1997. 3. Wafer size：6 inch. |